E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology

E18500 - SEMI E185 - Specification for 300 mm Tape Frame FOUP StdTpc-Automation Technology1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the Tape Frame FOUP which is intended to be used to transport and store 300 mm tape frames, as specified by SEMI G74 and SEMI G87, within IC manufacturing facilities. 2 Scope 2. 1 This Standard specifies the external features and dimensions of the Tape Frame FOUP. 2. 2 This Standard specifies the internal dimensions for storing the tape frames in the Tape

Users should be able to calculate the COO for any gas delivery equipment using this Guide

and unambiguously

1 — Specification for SOAP Binding of Data Collection Management (DCM)

which define the properties of the substrate and the epitaxial layer

previously published November 2004

Gauges that differ in at least one system or subsystem may be considered different for the purpose of comparison

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Solar cells made of silicon will be manufactured for many years to come

and other information to recommend jobs that maximize effective utilization of factory resources to satisfy product demand and planned objectives

and materials use in SME in order to promote efficiency

SEMI E114-0302E (Reapproved 0309)

Two test methods are covered as follows: