MF015400 - SEMI MF154 - Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces StdPbc-1021

MF015400 - SEMI MF154 - Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces StdPbc-1021The purpose of this Guide is to list, illustrate, and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers. Ambiguities and uncertainties regarding surface defects may be resolved by reference to this Guide. There is close alignment between this Guide and common specifications used for the purchase of silicon wafers. This Guide contains a compilation of the most commonly observed

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3  Wafer thinning technology becomes popular to meet the demand for thin packages

Changes were made to ¶ 6

SEMI MF1726-1110 (technical revision)

and the mutual positional relationship required to describe each position when AMHS loads and unloads the substrate to or from the manufacturing equipment

Roughness nomenclature is intended to remove ambiguities with respect to identifying the roughness measurements used and the results achieved

the depolarization effect of color filters is obtained by measuring the reduction in polarization efficiency when polarized light passes through color filters

in the matrices of interest

the necessity to meet new demands such as single substrate transfer has been increasing

SEMI D21-1000 (technical revision)

Breakdown strength (see SEMI G75

org September 2002